Micron to build semiconductor packaging facility in Singapore
iTnews Asia - 08 Jan 2025Micron Technology has announced its plan to build a high-bandwidth memory (HBM) advanced packaging facility in Singapore to meet the demands of AI growth.
Micron
Micron Technology has announced its plan to build a high-bandwidth memory (HBM) advanced packaging facility in Singapore to meet the demands of AI growth.
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Micron to build semiconductor packaging facility in Singapore
iTnews Asia - 09 Jan 2025Micron to build semiconductor packaging facility in Singapore ...
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